Equipment development services - Company Ranking(42 companies in total)
Last Updated： Aggregation Period:Oct 01, 2025〜Oct 28, 2025
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Display Company Information
| Company Name | Featured Products | ||
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| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Other Features】 ■ Z-axis operation and bond load are computer-controlled, eliminating differences in bondability due to the operator. ■ Eas... | Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi... | ||
| 【Ball】 Ball bonding: Bumping, Coining, Security Bond, Tab compatible Compatible wire types: Gold wire, Copper wire (Cu kit option) 【We... | Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi... | ||
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- Featured Products
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MPP Corporation's "Manual Wire Bonder iBond5000 Series"
- overview
- 【Other Features】 ■ Z-axis operation and bond load are computer-controlled, eliminating differences in bondability due to the operator. ■ Eas...
- Application/Performance example
- Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi...
MPP Manual Wire Bonder iBond 5000 Series
- overview
- 【Ball】 Ball bonding: Bumping, Coining, Security Bond, Tab compatible Compatible wire types: Gold wire, Copper wire (Cu kit option) 【We...
- Application/Performance example
- Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi...
-
兼松ＰＷＳ
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