Equipment development services - Company Ranking(41 companies in total)
Last Updated： Aggregation Period:Feb 18, 2026〜Mar 17, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Features】 ○ Vibration-damping control XY stage that achieves low vibration ○ Ultra-compact recoil-free cut clamp ○ High-speed bonding head ... | For more details, please contact us. | ||
| 【Features】 ○ Ultra-fast bonding: 58 milliseconds/wire ○ Fine pitch compatible: 35μm ○ Various loop modes available ○ High variety compatibil... | For more details, please contact us. | ||
| ◆◇◆ Features ◆◇◆ ◆ High-speed bonding: 54 milliseconds/wire With loop control; wire length 0.5mm ◆ Pad opening compatibility: 35μm ◆ ... | For more details, please contact us. | ||
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カイジョー ODM事業部
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- Featured Products
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Semiconductor assembly equipment Wire Bonder FB-900
- overview
- 【Features】 ○ Vibration-damping control XY stage that achieves low vibration ○ Ultra-compact recoil-free cut clamp ○ High-speed bonding head ...
- Application/Performance example
- For more details, please contact us.
Semiconductor assembly equipment Wire Bonder FB-780
- overview
- 【Features】 ○ Ultra-fast bonding: 58 milliseconds/wire ○ Fine pitch compatible: 35μm ○ Various loop modes available ○ High variety compatibil...
- Application/Performance example
- For more details, please contact us.
Wire Bonder - Fully Automatic Wire Bond
- overview
- ◆◇◆ Features ◆◇◆ ◆ High-speed bonding: 54 milliseconds/wire With loop control; wire length 0.5mm ◆ Pad opening compatibility: 35μm ◆ ...
- Application/Performance example
- For more details, please contact us.
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カイジョー ODM事業部
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